Double system for parallel circuit board testing
Inline system for complete THT inspection – placement control, solder joint inspection,
full-area solder bead detection, and more.
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Product Features
Reliable fault detection
· Solder bridges, solder splashes
· Scattered solder balls (within full surface) up to 100um
· Open solder joints, missing pins, bent connectors
· Recognition of DMC / barcode on the verification side without additional Reader
High inspection depth
and large test range
· High-resolution color scanner
· Multi-color LED lighting
· Real 24-bit color, 14.040x20.400 pixels per scan
· Test range: max. 420mm * 550mm
· High speed: 25mm/sec
· Achromatic lens for parallax free display
Simple user interface
· Indication of fault location and display of error and comparison image
· Identical presentation to the test system and repair stations
· Fault is easily assigned by pressing the statistics button
· Training of operators within minutes
Statistics and process control
· Traceability by evaluating barcode/2D-Code/RFID
· Cost savings due to fast process optimization
· Intuitive test plan creation
· GUI
· Powerful and flexible test algorithms
Under floor system
· Inspection of the PCB bottom side without flip unit
· Seamless integration into the manufacturing process behind the selective and wave soldering system
Double system
Line integration
Offline system
· Double-sided inspection of THT solder joints and components inside line cycle time within one unit
· Flexible repair station concepts
· Easy integration into the placement line
· Data mapping by barcode/2D-Code/RFID
· Easy handling with drawer and variable PCB fixtures
